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Through wafer interconnects(TWIn) realized by thermal diffusion of boron in p-type silicon wafer
- Jae-Hyoung Park;
- Byung-Wook Yoo;
- Joon-Geun Ha;
- Yong-Kweon Kim
- 제목
- Through wafer interconnects(TWIn) realized by thermal diffusion of boron in p-type silicon wafer
- 저자
- Jae-Hyoung Park; Byung-Wook Yoo; Joon-Geun Ha; Yong-Kweon Kim
- 발행일
- 2010-04-02
- 학회명
- 12th Korean MEMS Conference
- 개최지
- 부산
- 개최국가
- 대한민국
- 학회 개최일
- 2010-04-01 ~ 2010-04-03